Semiconductor Die Bonding and Vacuum Packaging System
Posted
Sep 16, 2026
Location
Washington, District of Columbia
Description
https://api.sam.gov/prod/opportunities/v1/noticedesc?noticeid=68c5094fd20d471388d9a1346950e9f7
Details
- Notice ID
- 68c5094fd20d471388d9a1346950e9f7
- Solicitation Number
- N0017326P2436
- NAICS Code
- 333993
- Classification Code
- 3540
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