Semiconductor Die Bonding and Vacuum Packaging System
Posted
Jun 16, 2026
Due Date
Jul 1, 2026
Location
District of Columbia
Description
https://api.sam.gov/prod/opportunities/v1/noticedesc?noticeid=6ff893c1237d4a1f94a73d0dbd494c99
Details
- Notice ID
- 6ff893c1237d4a1f94a73d0dbd494c99
- Solicitation Number
- N00173-26-RFI-KN02
- NAICS Code
- N/A
- Classification Code
- N/A
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