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Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture - Combined Sources Sought Notice/ Notice of Intent to Sole Source

SAM
NONE
Sources Sought

Posted

Nov 20, 2025

Due Date

Dec 3, 2025

Location

Boulder, Colorado

Description

https://api.sam.gov/prod/opportunities/v1/noticedesc?noticeid=74745b1823ec4651b8a392a663b7429c

Details

Notice ID
74745b1823ec4651b8a392a663b7429c
Solicitation Number
NIST-SS26-CHIPS-04
NAICS Code
541713
Classification Code
AJ12

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