Photonic integrated circuit packaging service for 8 PICs. Includes wore bonding to PCB, fiber alignment and bonding of FAUs and associated process development and engineering costs.
Posted
Aug 10, 2026
Due Date
Aug 12, 2026
Description
https://api.sam.gov/prod/opportunities/v1/noticedesc?noticeid=9517449fa10b4afd8b72b245d5a29ed8
Details
- Notice ID
- 9517449fa10b4afd8b72b245d5a29ed8
- Solicitation Number
- 80NSSC26939631Q
- NAICS Code
- 813920
- Classification Code
- 6099
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