Multichip Module Package for SiC Pressure Sensors
Posted
Jun 26, 2026
Due Date
Jun 30, 2026
Location
Cleveland, Ohio
Description
https://api.sam.gov/prod/opportunities/v1/noticedesc?noticeid=be8e1f1156144652a73c065ffad6e328
Details
- Notice ID
- be8e1f1156144652a73c065ffad6e328
- Solicitation Number
- 80NSSC26936730Q
- NAICS Code
- 334419
- Classification Code
- 6695
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