Die Bonding and Vacuum Packaging System
Posted
Aug 3, 2026
Due Date
Aug 7, 2026
Location
District of Columbia
Description
https://api.sam.gov/prod/opportunities/v1/noticedesc?noticeid=c4eb0db47a1d4e639aa964038a2b45fb
Details
- Notice ID
- c4eb0db47a1d4e639aa964038a2b45fb
- Solicitation Number
- N0017326QKN05
- NAICS Code
- 333993
- Classification Code
- 3540
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