Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture
Posted
Nov 18, 2025
Due Date
Dec 3, 2025
Location
Boulder, Colorado
Description
https://api.sam.gov/prod/opportunities/v1/noticedesc?noticeid=cd4d1c10e92745f0a0a5ad1ebe4a248d
Details
- Notice ID
- cd4d1c10e92745f0a0a5ad1ebe4a248d
- Solicitation Number
- NIST-SS26-CHIPS-04
- NAICS Code
- 541713
- Classification Code
- AJ12
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