Purchase of silicon-based photonics integrated circuit (PICs) for laboratory testing for the AstroPIC project.

NASA’s Nano‑Astrophotonics (AstroPIC) project at Ames Research Center requires the fabrication and delivery of 56 silicon‑on‑insulator photonic integrated circuit (PIC) dies for laboratory testing of high‑contrast imaging coronagraphy. The devices must be produced from NASA‑provided layout files (e.g., ant_apr26_121_ACHIP.gds, AstroPIC_main.gds, etc.) with specific quantities per design, and must meet strict fabrication tolerances: partial etch depth of 70 nm ± 10 nm, full etch depth of 220 nm, oxide cladding thickness of 2.2 µm ± 0.2 µm, tri‑layer metallization (TiW/Au) on five wafers, 250 µm deep thermal isolation trenches, and, where applicable, MEMS release features, via openings, and direct metallization. Dicing will produce the 56 dies, which are to be shipped to NASA Ames (Building N255, Central Receiving, Moffett Field, CA) with an estimated delivery timeline of approximately 16 weeks after order receipt. The procurement will be a sole‑source award to Applied Nanotools (ANT) under FAR 12.102(a), NAICS 334413, using FAR Part 12 commercial item procedures. Interested parties may submit written capabilities and qualifications to the primary point of contact, Kacey Hickman (kacey.l.hickman@nasa.gov), no later than 15:00 CST on 22 June 2026. The contract will be administered by NASA Shared Services Center, and all communications must be in writing; oral responses are not acceptable.

Notice ID

f6a29163e887446cba020a99e0476190

Solicitation Number

80NSSC26936131Q

NAICS Code

334413

Classification Code

6695